Bit RNB-1315

Bit RNB-1315
Bit RNB-1315 Bit RNB-1315 Bit RNB-1315 Bit RNB-1315
Производитель: Beltronic
Артикул: Bit RNB-1315
Цена: ПО ЗАПРОСУ
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Промышленный защищенный ноутбук Bit RNB-1315 во всепогодном исполнении IP65 удовлетворяет самым высоким военным стандартам защищённости MIL-STD 810G. Рабочие температуры до -30 градусов. Построен на базе процессоров Intel® Core™ i7 / i5 / i3 vPro™. Оснащён сенсорным экраном 13.3” Wide Active Matrix TFT, WXGA 1000 nits.

Features:

  • Powered by Intel® Core™ i7 vPro™ CPU
  • 13.3“ WXGA and Touch Screen
  • 1,000 nit Sunlight-Readable
  • Resolution QXGA up to 2048 x 1536
  • Operating Temperature -30°C to 60°C
  • GPS Receiver Support
  • Gobi™ 2000 PCIe mini Card
  • Full Magnesium Alloy Case
  • MIL-STD 810G and IP 65 Complaint
  • Finger Print Reader
  • 3 Years Warranty
Paired with Intel® Core™ i7 vPro™ processor, Bit-RNB offers industry efficiency, extraordinary battery durability with fan-less design. It also features sturdy magnesium-aluminum alloy enclosure, shock-protected HDD and sealed I/O ports, and is impact resistant. MIL-STD-810G and IP65 certified, Bit-RNB with dust and waterproof capabilities presents professionals working in demanding environments with a multifunctional and reliable solution.
  • Adaptive to different user contexts, Bit-RNB comes with a full-sized keyboard of 88 keys and a resistive multi-touch screen that would allow users to operate with gloves on.
  • It integrates a finger print reader and multiple connection capabilities including blue tooth, WLAN and WWAN, making it the best choice for field
Processor
Customer-side optionrPGA socket(i7-620LE BGA1288 ONLY)TDP 25W(Fanless)
-- Intel® Core™ i7-620LM vPro™ (4M Cache, 2.00 GHz)
TDP 18W(Fanless) (BGA)
-- Intel® Core™ i5-560UM vPro™ (3M Cache, 1.33 GHz)

-- Intel® Core™ i3-330UM vPro™ (3M Cache, 1.20GHz)
TDP 35W(Fan cooling system)
--Intel® Core™ i7-620M vPro™ (4M Cache, 2.66 GHz)
--Intel® Core™ i5-540M vPro™ (3M Cache, 2.53GHz)
--Intel® Core™ i5-520M vPro™ (3M Cache, 2.40GHz)
--Intel® Core™ i3-350M vPro™ (3M Cache, 2.26GHz)
--Intel® Celeron® Processor P4500((2M Cache, 1.86 GHz)
BIOS
AMI Aptio®TAA socket
Chipset
Choice of Intel® Ibex Peak-M PCH QM57 and HM55TDP 3.5W
Main Memory
2GB DDR3-1333 MHzDual-channel SO-DIMM (up to 8GB)
Display
13.3” Wide Active Matrix TFT,WXGA 1280x8004 wires Resistive Touch Panel support1000 nits Sunlight Readable LCD with Multi-Touch screenLR Touch Panelwith AOT bonding(option)
Graphics
Intel Graphics Media Accelerator HD Graphics (GMA5700MHD)
CRT Display
Up to QXGA 2048 x 1536
Storage
2.5” SATA HDD w/S.M.A.R.T.SATA HDD 350G 5400R 2.5',With HeaterShock-mounted Removable HDD2.5” SATA SSD (Option)
Card Slot
Choice of the following options:Express Card 34/54(share with PCMCIA II option)SD Card Reader
Connectivity
WLAN :Intel WiFi Link 6200 2x2 802.11a/bgn PCIe mini card
WWAN :Gobi 2000 PCIe mini cardGPS Receiver Support
LAN : 10/100/1000Mbps
PAN : Bluetooth 2.1 + EDR
Modem : modem module 56kbps (V.92)(option)
Multi-bay
Slim type Super Multi DVD & Smartcard Reader
(for Fanless Model only)
LED Status Indicator
Power on/SuspendBattery Full /Charging/Low HDD AccessWWAN ConnectivityWLAN ConnectivityBluetooth ConnectivityCaps Locksupport 8 levels brightness adjustable
Interface
1 x Serial Port RS232 (RS-422/485 switchable)1 x D-sub for external monitor2 x USB 2.0 A ports(Host, Function, Memory Port)1 x External Antenna(GPS & WWAN switchable)2 x LAN (10/100/1000,only one support Vpro) 1 x RJ11 (option)1 x DC-in1 x SD Card Reader1 x Contact Smart Card Reader1 x Audio Jack : Ear Phone-out / optical SPDIF out1 x Audio Jack : MIC-in1 x Docking Connecter ((PoGo Pin)r)1 x SIM Card1 x fingerprint scanner1 x half-sized PCIe mini card slots for WLAN1 x full-sized PCIe mini card slots for WWAN
Audio
HD AudioBuilt-in Speaker x 2 (Total Max:4W)Microphone x 2 (array microphone)
Keyboard
US keyboardbacklight (support 8 levels brightness adjustable)(Option)IP 65
Power Management
ACPI 3.0 supported
Power
Input voltage:12V~36VInput current@24Vdc: 3.75 Amps typical (7.5 Amps max)
Battery
Li-ion 9 cells, 7800 mAh,Charging Time : 2.5hrs to 80%Li-ion 8400mAh & 9000mAh (Option)Built-in Gauge IC
AC adapter
Output : 19V DC, 90WInput : 100~240V AC, 50/60Hz Universal3 pin Compact Power Supply SystemMilitary Adapter (option)
Pointing Device
Built-in Resistive Touch Panel with StylusWater Proof Resistive Mouse Pad
Heat Dissipation
Thermal module with speed-variable fan.(TDP 35W)Fanless.(TDP 18W/25W)
Dimensions/Weight
344mm x 297.6mm x 58mmWeight < 4.1KG(Include Battery)
Security
TPM 1.2 (Trusted Platform Module)Optional Fingerprint ReaderKensington LockSmart Card Reader
Hot Key
SAS KeyRF SwitchBrightness Up / DownScreen Rotation KeyLED Backlight Keyboard Light On/Off
Durability Features
Fully ruggedMIL-STD 810G and IP65 CompliantMIL-STD 461F/E compliant (Option)
(CE101/CE102/RE102/CS101/CS114/RS101/RS103)
Additional Spec
 
Regulation
EMI: FCC, CESafety: CB, CUL/ULPower: EPEAT Silver, Energy Star v5.0, and EuP
Windows Certification
Compatibility: HCT V12.0 / DTMLanguage: US International Supported OS: Windows 7, Windows XP,
Environmental Specification
Operating temp: -30°C to 60°CStorage temp: -30°C to 60°CHumidity: 5% to 95% RH, non-condensing
Environmental Standard
 
Enclosure
Water Resistance:
According to Mil Std 810G-506.5, Procedure II., IEC 60529 Edition2.1 : 2001-02-IPx5 (International Electro technical Commission Publication)
Drop
According to Mil Std 810G-516.6, Procedure IV26 times 3 feet height free drop onto Plywood on concrete (8 corners, 12 edges and 6 faces Total 26 drops)
Temperature
High Temp: According to MIL-STD-810G 501.5 Procedures I (Storage) and II (Operation)Low Temp: According to MIL-STD-810G 502.5 Procedures I (Storage) and II (Operation)
Thermal Shock
According to MIL-STD-810G 503.5 Procedures I
Vibration
Operating:According to MIL-STD 810G 514.6 Procedure IAccording to ASTM 4169-99, Truck Assurance Level II, Schedule ENon-operating:According to MIL-STD 810G 514.6 Procedure I, category 24, general minimum integrity
Humidity
According to MIL-STD-810G 507.5 Procedures II
Altitude
According to MIL-STD-810G 500.5 Procedures I (Storage) and II (Operation)
Shock
40G DesignAccording to Mil Std 810G-516.6, Procedure I
Dust Resistance
According to MIL-STD-810G 510.5,Procedure IAccording to IEC 60529 Edition2.1 : 2001-02-IP6X (International Electrotechnical Commission Publication)
Explosive Atmosphere
According to MIL-STD-810G 511.5 Procedure I
Freeze/Thaw
According to MIL-STD-810G 524 Procedure III
* The Dust Resistance/Explosive Atmosphere/Freeze Thaw 3 tests are not engage in the formal QTR testing schedule.

 

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