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Processor | Customer-side optionrPGA socket(i7-620LE BGA1288 ONLY)TDP 25W(Fanless) -- Intel® Core™ i7-620LM vPro™ (4M Cache, 2.00 GHz) TDP 18W(Fanless) (BGA) -- Intel® Core™ i5-560UM vPro™ (3M Cache, 1.33 GHz) -- Intel® Core™ i3-330UM vPro™ (3M Cache, 1.20GHz) TDP 35W(Fan cooling system) --Intel® Core™ i7-620M vPro™ (4M Cache, 2.66 GHz) --Intel® Core™ i5-540M vPro™ (3M Cache, 2.53GHz) --Intel® Core™ i5-520M vPro™ (3M Cache, 2.40GHz) --Intel® Core™ i3-350M vPro™ (3M Cache, 2.26GHz) --Intel® Celeron® Processor P4500((2M Cache, 1.86 GHz) |
BIOS | AMI Aptio®TAA socket |
Chipset | Choice of Intel® Ibex Peak-M PCH QM57 and HM55TDP 3.5W |
Main Memory | 2GB DDR3-1333 MHzDual-channel SO-DIMM (up to 8GB) |
Display | 13.3” Wide Active Matrix TFT,WXGA 1280x8004 wires Resistive Touch Panel support1000 nits Sunlight Readable LCD with Multi-Touch screenLR Touch Panelwith AOT bonding(option) |
Graphics | Intel Graphics Media Accelerator HD Graphics (GMA5700MHD) |
CRT Display | Up to QXGA 2048 x 1536 |
Storage | 2.5” SATA HDD w/S.M.A.R.T.SATA HDD 350G 5400R 2.5',With HeaterShock-mounted Removable HDD2.5” SATA SSD (Option) |
Card Slot | Choice of the following options:Express Card 34/54(share with PCMCIA II option)SD Card Reader |
Connectivity | WLAN :Intel WiFi Link 6200 2x2 802.11a/bgn PCIe mini card WWAN :Gobi 2000 PCIe mini cardGPS Receiver Support LAN : 10/100/1000Mbps PAN : Bluetooth 2.1 + EDR Modem : modem module 56kbps (V.92)(option) |
Multi-bay | Slim type Super Multi DVD & Smartcard Reader (for Fanless Model only) |
LED Status Indicator | Power on/SuspendBattery Full /Charging/Low HDD AccessWWAN ConnectivityWLAN ConnectivityBluetooth ConnectivityCaps Locksupport 8 levels brightness adjustable |
Interface | 1 x Serial Port RS232 (RS-422/485 switchable)1 x D-sub for external monitor2 x USB 2.0 A ports(Host, Function, Memory Port)1 x External Antenna(GPS & WWAN switchable)2 x LAN (10/100/1000,only one support Vpro) 1 x RJ11 (option)1 x DC-in1 x SD Card Reader1 x Contact Smart Card Reader1 x Audio Jack : Ear Phone-out / optical SPDIF out1 x Audio Jack : MIC-in1 x Docking Connecter ((PoGo Pin)r)1 x SIM Card1 x fingerprint scanner1 x half-sized PCIe mini card slots for WLAN1 x full-sized PCIe mini card slots for WWAN |
Audio | HD AudioBuilt-in Speaker x 2 (Total Max:4W)Microphone x 2 (array microphone) |
Keyboard | US keyboardbacklight (support 8 levels brightness adjustable)(Option)IP 65 |
Power Management | ACPI 3.0 supported |
Power | Input voltage:12V~36VInput current@24Vdc: 3.75 Amps typical (7.5 Amps max) |
Battery | Li-ion 9 cells, 7800 mAh,Charging Time : 2.5hrs to 80%Li-ion 8400mAh & 9000mAh (Option)Built-in Gauge IC |
AC adapter | Output : 19V DC, 90WInput : 100~240V AC, 50/60Hz Universal3 pin Compact Power Supply SystemMilitary Adapter (option) |
Pointing Device | Built-in Resistive Touch Panel with StylusWater Proof Resistive Mouse Pad |
Heat Dissipation | Thermal module with speed-variable fan.(TDP 35W)Fanless.(TDP 18W/25W) |
Dimensions/Weight | 344mm x 297.6mm x 58mmWeight < 4.1KG(Include Battery) |
Security | TPM 1.2 (Trusted Platform Module)Optional Fingerprint ReaderKensington LockSmart Card Reader |
Hot Key | SAS KeyRF SwitchBrightness Up / DownScreen Rotation KeyLED Backlight Keyboard Light On/Off |
Durability Features | Fully ruggedMIL-STD 810G and IP65 CompliantMIL-STD 461F/E compliant (Option) (CE101/CE102/RE102/CS101/CS114/RS101/RS103) |
Additional Spec | |
Regulation | EMI: FCC, CESafety: CB, CUL/ULPower: EPEAT Silver, Energy Star v5.0, and EuP |
Windows Certification | Compatibility: HCT V12.0 / DTMLanguage: US International Supported OS: Windows 7, Windows XP, |
Environmental Specification | Operating temp: -30°C to 60°CStorage temp: -30°C to 60°CHumidity: 5% to 95% RH, non-condensing |
Environmental Standard | |
Enclosure | Water Resistance: According to Mil Std 810G-506.5, Procedure II., IEC 60529 Edition2.1 : 2001-02-IPx5 (International Electro technical Commission Publication) |
Drop | According to Mil Std 810G-516.6, Procedure IV26 times 3 feet height free drop onto Plywood on concrete (8 corners, 12 edges and 6 faces Total 26 drops) |
Temperature | High Temp: According to MIL-STD-810G 501.5 Procedures I (Storage) and II (Operation)Low Temp: According to MIL-STD-810G 502.5 Procedures I (Storage) and II (Operation) |
Thermal Shock | According to MIL-STD-810G 503.5 Procedures I |
Vibration | Operating:According to MIL-STD 810G 514.6 Procedure IAccording to ASTM 4169-99, Truck Assurance Level II, Schedule ENon-operating:According to MIL-STD 810G 514.6 Procedure I, category 24, general minimum integrity |
Humidity | According to MIL-STD-810G 507.5 Procedures II |
Altitude | According to MIL-STD-810G 500.5 Procedures I (Storage) and II (Operation) |
Shock | 40G DesignAccording to Mil Std 810G-516.6, Procedure I |
Dust Resistance | According to MIL-STD-810G 510.5,Procedure IAccording to IEC 60529 Edition2.1 : 2001-02-IP6X (International Electrotechnical Commission Publication) |
Explosive Atmosphere | According to MIL-STD-810G 511.5 Procedure I |
Freeze/Thaw | According to MIL-STD-810G 524 Procedure III |
* The Dust Resistance/Explosive Atmosphere/Freeze Thaw 3 tests are not engage in the formal QTR testing schedule. |