Computer System2> | |
CPU Card | miniITX Core2Duo Board |
Chipset | Intel 945 GME Chipset |
CPU | Intel Core2Duo T7400 Prozessor (2,16 GHz) |
Memory | DDR2, 4 Gbyte |
Graphic Controller | Chipset Integrated with dual DVI or single DVI and Single CRT |
Storage DevicesMass Storage | |
Interfaces | 80 GByte HDD or 64 GByte SSD in removable frame (see option list) |
USB | USB 2.0 ports integrated in HID interfaces |
VGA | HID-CRT - VGA/CRT Interface with PS/2, USB and RS232 (IP65 Round Connector) |
DVI | HID-DVI – DVI Interface with 2x Single Channel DVI and 2x USB 2.0 (IP65 Round Connector) |
Ethernet | RJ45 with 10/100/1000 mBit/s (IP65 Round Connector) |
Power | |
Supply | Voltage DC17V-36V DC input on IP65 Round Connector (MIL 1275 compliant) |
Mechanics | |
Material | Precision milled aluminum enclosure |
Coating / Painting | Surtec 650 surface treatment with olive powder coating |
Outside Dimensions | 19” width rack mount with 1.5u or 4u, depth ~350mm |
Weight | ~ 8 kg |
Special Features | HDD/SSD removable drive behind Cover |
Environmental Conditions | |
Temperature | -40°C – 55°C Operating (Pre-Heating System is integrated in smart power supply) MIL-STD 810F, Method 501.4, Proc. II (Operating), Climatic Category Hot MIL-STD 810F, Method 502.4, Proc. II (Operating), Climatic Category Basic Cold (C1) -46°C – 71°C Storage MIL-STD 810F, Method 501.4, Proc. I (Storage), Climatic Category Hot MIL-STD 810F, Method 502.4, Proc. I (Storage), Climatic Category Cold (C2) |
Humidity | 5% - 95% rh non condensating MIL-STD-810F, Method 507.4 |
Operating Altitude | 4570 m Operating MIL-STD 810F, Method 500.4, Proc II (Operating) 12000 m Storage MIL-STD 810F, Method 500.4, Proc I (Storage) |
Vibration | 2g 10-200 Hz, all 3 axis MIL-STD 810F, Method 514.5, Proc. I (General Vibration) (limited to 2g with HDD Option) |
Shock | 50g 18ms, all 3 axis MIL-STD 810F, Method 516.5, Proc. I (Functional Shock) |
IP Protection | IP65 (DIN EN 60259 / IEC 529) IP55 (DIN EN 60259 / IEC 529) only for rear side fans |
MIL-STD | All references to MIL-STD 810F are “designed and build to be complaint to” |
EMC / EMI | |
CE | DIN EN 55022: 1998-04 Class A DIN EN 55024: 2003-10 (DIN EN 61000-4-2: 2001-12, DIN EN 61000-4-3: 2001-12, DIN EN 61000-4-4: 2002-07, DIN EN 61000-4-5: 2001-12, DIN EN 61000-4-6: 2001-12, DIN EN 61000-4-8: 2001-12, DIN EN 61000-4-11: 2001-12) DIN EN 61000-3-2: 2001-12 DIN EN 61000-3-3: 2002-05 DIN EN 60950/A11:1997 |
MIL-STD 461F | Conducted Susceptibility CS101, CS114, CS115, CS116 Conducted Emission CE102 Radiated Emission RE102 Radiated Susceptibility RS103 |
MIL-STD | All references to MIL-STD 461F are “designed and build to be complaint to” |
Ordering Information | |
Art.Nr. 00000689 | BIT-IPC-0022D-MIL-1H5 BZ2.1 (without HDD/SSD, without external cabling) |
Art.Nr. 00001743 | BIT-IPC-0022D-1H5 BZ 2.1 Option HDD 80GByte |
Art.Nr. 00001744 | BIT-IPC-0022D-1H5 BZ 2.1 Option SSD 64GByte |
Art.Nr. 00001746 | BIT-IPC-00xx-MIL-1H5 DC Power Kabel 3m |
Art.Nr. 00001745 | BIT-IPC-00xx-MIL-1H5 HID-CRT Interface Splitter (30 cm) |
Art.Nr. 00000691 | BIT-IPC-00xx-MIL-1H5 HID-DVI Interface Splitter (30 cm) |